Pilot Datasheet v2.5
BIASING CIRCUIT SCHEMATIC:
VDD
100pF
100nF
RF Output
RF Input
ASSEMBLY DIAGRAM:
It is recommended that the RF connections be made using bond wires with 25µm diameter and a
maximum length of 300µm. Ground connections should be made according to the required bias
conditions.
To Evaluation Board via an 0402
Surface Mounted capacitor (100nF)
100pF Chip Capacitor
Ground connection
User application
50 Ohms line
User application
50 Ohms line
BILL OF MATERIALS:
COMPONENT
All RF tracks should be 50Ω characteristic material
Capacitor, 100pF, chip capacitor
Capacitor, 100nF, 0402
5
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
