SOIC-16 Tape and Reel Data and Package Dimensions, continued
SOIC(16lds) Embossed Carrier Tape
Configuration:
Figure 3.0
T
E1
P0
D0
F
K0
Wc
B0
E2
W
Tc
A0
P1
D1
User Direction of Feed
Dimensions are in millimeter
Pkg type
SOIC(16lds)
(16mm)
A0
6.60
+/-0.30
B0
10.35
+/-0.25
W
16.0
+/-0.3
D0
1.55
+/-0.05
D1
1.60
+/-0.10
E1
1.75
+/-0.10
E2
14.25
min
F
7.50
+/-0.05
P1
8.0
+/-0.1
P0
4.0
+/-0.1
K0
2.40
+/-0.40
T
0.450
+/-0.150
Wc
13.0
+/-0.3
Tc
0.06
+/-0.02
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
10 deg maximum
Typical
component
cavity
center line
0.9mm
maximum
B0
10 deg maximum component rotation
0.9mm
maximum
Sketch A (Side or Front Sectional View)
Component Rotation
A0
Sketch B (Top View)
Typical
component
center line
Sketch C (Top View)
Component lateral movement
SOIC(16lds) Reel Configuration:
Figure 4.0
Component Rotation
W1 Measured at Hub
Dim A
Max
B Min
Dim C
Dim A
max
Dim D
min
Dim N
DETAIL AA
See detail AA
W3
13" Diameter Option
W2 max Measured at Hub
Dimensions are in inches and millimeters
Tape Size
16mm
Reel
Option
13" Dia
Dim A
13.00
330
Dim B
0.059
1.5
Dim C
512 +0.020/-0.008
13 +0.5/-0.2
Dim D
0.795
20.2
Dim N
4.00
100
Dim W1
0.646 +0.078/-0.000
16.4 +2/0
Dim W2
0.882
22.4
Dim W3 (LSL-USL)
0.626 – 0.764
15.9 – 19.4
July 1999, Rev. B
FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
