欢迎访问ic37.com |
会员登录 免费注册
发布采购

IRF640 参数 Datasheet PDF下载

IRF640图片预览
型号: IRF640
PDF下载: 下载PDF文件 查看货源
内容描述: 18A , 200V , 0.180 Ohm的N通道功率MOSFET [18A, 200V, 0.180 Ohm, N-Channel Power MOSFETs]
分类和应用:
文件页数/大小: 7 页 / 133 K
品牌: FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
 浏览型号IRF640的Datasheet PDF文件第1页浏览型号IRF640的Datasheet PDF文件第3页浏览型号IRF640的Datasheet PDF文件第4页浏览型号IRF640的Datasheet PDF文件第5页浏览型号IRF640的Datasheet PDF文件第6页浏览型号IRF640的Datasheet PDF文件第7页  
IRF640, RF1S640, RF1S640SM
Absolute Maximum Ratings
T
C
= 25
o
C, Unless Otherwise Specified
IRF640, RF1S640, RF1S640SM
200
200
18
11
72
±20
125
1.0
580
-55 to 150
300
260
UNITS
V
V
A
A
A
V
W
W/
o
C
mJ
o
C
o
C
o
C
Drain to Source Breakdown Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DS
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
T
C
= 100
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Dissipation Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Pulse Avalanche Energy Rating (Note 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
AS
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
Package Body for 10s, See TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
pkg
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. T
J
= 25
o
C to 125
o
C.
Electrical Specifications
PARAMETER
Drain to Source Breakdown Voltage
Gate Threshold Voltage
Zero Gate Voltage Drain Current
On-State Drain Current (Note 1)
Gate to Source Leakage Current
T
C
= 25
o
C, Unless Otherwise Specified
SYMBOL
BV
DSS
V
GS(TH)
I
DSS
I
D(ON)
I
GSS
r
DS(ON)
gfs
t
d(ON)
t
r
t
d(OFF)
t
f
Q
g(TOT)
Q
gs
Q
gd
C
ISS
C
OSS
C
RSS
L
D
Measured From the
Contact Screw on Tab to
Center of Die
Measured From the Drain
Lead, 6mm (0.25in) From
Package to Center of Die
Modified MOSFET
Symbol Showing the
Internal Devices
Inductances
D
L
D
TEST CONDITIONS
I
D
= 250µA, V
GS
= 0V, (Figure 10)
V
GS
= V
DS
, I
D
= 250µA
V
DS
= Rated BV
DSS
, V
GS
= 0V
V
DS
= 0.8 x Rated BV
DSS
, V
GS
= 0V, T
J
= 125
o
C
V
DS
> I
D(ON)
x r
DS(ON)MAX
, V
GS
= 10V (Figure 7)
V
GS
=
±20V
I
D
= 10A, V
GS
= 10V (Figures 8, 9)
V
DS
10V, I
D
= 11A (Figure 12)
V
DD
= 100V, I
D
18A, R
GS
= 9.1Ω, R
L
= 5.4Ω,
MOSFET Switching Times are Essentially
Independent of Operating Temperature
MIN
200
2
-
-
18
-
-
6.7
-
-
-
-
-
-
-
-
-
-
-
TYP
-
-
-
-
-
-
0.14
10
13
50
46
35
43
8
22
1275
400
100
3.5
MAX
-
4
25
250
-
±100
0.18
-
21
77
68
54
64
-
-
-
-
-
-
UNITS
V
V
µA
µA
A
nA
S
ns
ns
ns
ns
nC
nC
nC
pF
pF
pF
nH
Drain to Source On Resistance (Note 1)
Forward Transconductance (Note 1)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
(Gate to Source + Gate to Drain)
Gate to Source Charge
Gate to Drain “Miller” Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Internal Drain Inductance
V
GS
= 10V, I
D
18A, V
DS
= 0.8 x Rated BV
DSS
(Figure 14) Gate Charge is Essentially Independent
of Operating Temperature
I
G(REF)
= 1.5mA
V
DS
= 25V, V
GS
= 0V, f = 1MHz (Figure 11)
-
4.5
-
nH
Internal Source Inductance
L
S
Measured From the
Source Lead, 6mm
(0.25in) from Header to
Source Bonding Pad
-
G
L
S
S
7.5
-
nH
Thermal Resistance Junction to Case
Thermal Resistance Junction to
Ambient
R
θJC
R
θJA
R
θJA
Free Air Operation, IRF640
RF1S640SM Mounted on FR-4 Board with Minimum
Mounting Pad
-
-
-
-
-
-
1
62
62
o
C/W
o
C/W
o
C/W
©2001 Fairchild Semiconductor Corporation
IRF640, RF1S640, RF1S640SM Rev. B