Package Dimensions
Through Hole
0.4" Lead Spacing
PIN 1
ID.
PIN 1
ID.
4
5
3
6
2
7
1
4
3
2
1
0.270 (6.86)
0.250 (6.35)
8
0.270 (6.86)
0.250 (6.35)
0.390 (9.91)
0.370 (9.40)
5
6
7
8
0.070 (1.78)
0.045 (1.14)
0.390 (9.91)
0.370 (9.40)
0.020 (0.51) MIN
0.200 (5.08)
0.140 (3.55)
0.070 (1.78)
0.045 (1.14)
0.154 (3.90)
0.120 (3.05)
0.004 (0.10) MIN
0.200 (5.08)
0.140 (3.55)
15° MAX
0.022 (0.56)
0.016 (0.41)
0.016 (0.40)
0.008 (0.20)
0.154 (3.90)
0.120 (3.05)
0.300 (7.62)
TYP
0.100 (2.54) TYP
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.016 (0.40)
0.008 (0.20)
0.400 (10.16)
TYP
0.100 (2.54) TYP
Surface Mount
8-Pin DIP – Land Pattern
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
PIN 1
ID.
4
3
2
1
0.060 (1.52)
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)
0.030 (0.76)
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.020 (0.51)
MIN
0.016 (0.41)
0.008 (0.20)
0.045 (1.14)
0.022 (0.56)
0.016 (0.41)
0.315 (8.00)
MIN
0.100 (2.54)
TYP
0.405 (10.30)
MAX.
Lead Coplanarity : 0.004 (0.10) MAX
Note:
All dimensions are in inches (millimeters)
©2005 Fairchild Semiconductor Corporation
6N137, HCPL2601, HCPL2611, HCPL2630, HCPL2631 Rev. 1.0.7
www.fairchildsemi.com
9
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