Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.390 (9.91)
0.370 (9.40)
PIN 1
ID.
PIN 1
ID.
4
3
2
1
4
5
3
6
2
7
1
8
0.270 (6.86)
0.250 (6.35)
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.390 (9.91)
0.370 (9.40)
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51)
MIN
0.016 (0.41)
0.008 (0.20)
0.020 (0.51) MIN
0.200 (5.08)
0.140 (3.55)
0.154 (3.90)
0.120 (3.05)
0.045 [1.14]
0.022 (0.56)
0.016 (0.41)
0.022 (0.56)
0.016 (0.41)
15° MAX
0.315 (8.00)
MIN
0.016 (0.40)
0.008 (0.20)
0.100 (2.54)
TYP
0.300 (7.62)
TYP
0.100 (2.54) TYP
0.405 (10.30)
MIN
Lead Coplanarity : 0.004 (0.10) MAX
Package Dimensions (0.4"Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
PIN 1
ID.
4
3
2
1
0.070 (1.78)
0.270 (6.86)
0.250 (6.35)
0.060 (1.52)
5
6
7
8
0.390 (9.91)
0.370 (9.40)
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)
0.070 (1.78)
0.045 (1.14)
0.030 (0.76)
0.004 (0.10) MIN
0.200 (5.08)
0.140 (3.55)
0.154 (3.90)
0.120 (3.05)
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.016 (0.40)
0.008 (0.20)
0.400 (10.16)
TYP
0.100 (2.54) TYP
NOTE
All dimensions are in inches (millimeters)
12
Single-Channel: 6N138, 6N139 Dual-Channel: HCPL-2730, HCPL-2731 Rev. 1.0.0
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FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
