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FDS8447 参数 Datasheet PDF下载

FDS8447图片预览
型号: FDS8447
PDF下载: 下载PDF文件 查看货源
内容描述: 单N沟道PowerTrench MOSFET的 [Single N-Channel PowerTrench MOSFET]
分类和应用: 晶体晶体管功率场效应晶体管脉冲光电二极管PC
文件页数/大小: 6 页 / 421 K
品牌: FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
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Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage ID = 250µA, VGS = 0V  
40  
V
BVDSS  
TJ  
Breakdown Voltage Temperature  
Coefficient  
ID = 250µA, referenced to 25°C  
VDS = 32V, VGS = 0V  
TJ = 55°C  
VGS = ±20V, VDS = 0V  
34  
mV/°C  
1
µA  
µA  
nA  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
10  
±100  
On Characteristics (Note 2)  
VGS(th)  
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA  
1
1.8  
-5  
3
V
VGS(th)  
TJ  
Gate to Source Threshold Voltage  
ID = 250µA, referenced to 25°C  
Temperature Coefficient  
mV/°C  
VGS = 10V, ID = 12.8A  
9
10  
10.5  
12.3  
15  
rDS(on)  
gFS  
Drain to Source On Resistance  
Forward Transconductance  
VGS = 4.5V, ID = 11.4A  
mΩ  
VGS = 10V, ID = 12.8A,TJ = 125°C  
VDS = 10V, ID = 12.8A  
13  
75.3  
S
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
2000  
250  
150  
1.3  
2600  
350  
pF  
pF  
pF  
VDS = 20V, VGS = 0V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
250  
f = 1MHz  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
11  
14  
27  
7
20  
25  
42  
14  
49  
27  
ns  
ns  
VDD = 20V, ID = 12.8A  
VGS = 10V, RGEN = 4.5Ω  
Rise Time  
Turn-Off Delay Time  
ns  
Fall Time  
ns  
Qg  
Total Gate Charge at VGS = 10V  
Total Gate Charge at VGS = 5V  
Gate to Source Gate Charge  
Gate to Drain “Miller”Charge  
35  
19  
6
nC  
nC  
nC  
nC  
Qg  
VDS = 20V, ID = 12.8A,  
Qgs  
Qgd  
7
Drain-Source Diode Characteristics and Maximum Ratings  
VSD  
trr  
Source to Drain Diode Forward Voltage VGS = 0V, IS = 12.8A (note 2)  
0.84  
19  
1.2  
29  
19  
V
Reverse Recovery Time  
IF = 12.8A, diF/dt = 100A/µs  
Reverse Recovery Charge  
ns  
nC  
Qrr  
9.5  
Notes:  
1: R  
is the sum of the junction-to-case and case-to- ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the  
θJA  
drain pins. R  
is guaranteed by design while R  
is determined by the user’s board design.  
θJA  
θJC  
a) 50°C/W when  
mounted on a 1in  
pad of 2 oz copper  
b) 125°C/W when mounted on a  
minimum pad .  
2
Scale 1:1 on letter size paper  
2: Pulse Test: Pulse Width < 300 us, Duty Cycle < 2.0%.  
3: Starting T = 25°C, L = 3mH, I = 10A, V = 40V, V = 10V.  
J
AS  
DD  
GS  
FDS8447 Rev.B  
2
www.fairchildsemi.com  
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