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FDS6294 参数 Datasheet PDF下载

FDS6294图片预览
型号: FDS6294
PDF下载: 下载PDF文件 查看货源
内容描述: 30V N通道快速开关的PowerTrench ? MOSFET [30V N-Channel Fast Switching PowerTrench? MOSFET]
分类和应用: 开关
文件页数/大小: 5 页 / 139 K
品牌: FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
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FDS6294
Electrical Characteristics
Symbol
BV
DSS
∆BV
DSS
∆T
J
I
DSS
I
GSS
T
A
= 25°C unless otherwise noted
Parameter
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage
(Note 2)
Test Conditions
V
GS
= 0 V,
I
D
= 250
µA
Min Typ
30
27
Max
Units
V
mV/°C
Off Characteristics
I
D
= 250
µA,
Referenced to 25°C
V
DS
= 24 V,
V
GS
=
±20
V,
V
GS
= 0 V
V
DS
= 0 V
1
±100
µA
nA
On Characteristics
V
GS(th)
∆V
GS(th)
∆T
J
R
DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
On–State Drain Current
Forward Transconductance
V
DS
= V
GS
,
I
D
= 250
µA
I
D
= 250
µA,
Referenced to 25°C
V
GS
= 10 V,
I
D
= 13 A
V
GS
= 4.5 V,
I
D
= 12 A
V
GS
= 10 V, I
D
= 13 A, T
J
=125°C
V
GS
= 10 V,
V
DS
= 10 V,
V
DS
= 5 V
I
D
= 13 A
1
1.8
–5
9.4
11.5
13.5
3
V
mV/°C
11.3
14.4
16.5
mΩ
I
D(on)
g
FS
50
48
A
S
Dynamic Characteristics
C
iss
C
oss
C
rss
R
G
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
(Note 2)
V
DS
= 15 V,
f = 1.0 MHz
V
GS
= 0 V,
1205
323
102
0.9
pF
pF
pF
V
GS
= 15 mV, f = 1.0 MHz
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
V
DD
= 15 V,
V
GS
= 10 V,
I
D
= 1 A,
R
GEN
= 6
9
4
24
6
18
8
48
12
14
ns
ns
ns
ns
nC
nC
nC
V
DS
= 15 V,
V
GS
= 5 V
I
D
= 13 A,
10
3.5
3
Drain–Source Diode Characteristics and Maximum Ratings
I
S
V
SD
t
rr
Q
rr
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
V
GS
= 0 V,
I
S
= 2.1 A
(Note 2)
Voltage
Diode Reverse Recovery Time
I
F
= 13 A, d
iF
/d
t
= 100 A/µs
Diode Reverse Recovery Charge
2.1
0.74
25
14
1.2
A
V
nS
nC
Notes:
1.
R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a)
50°C/W when mounted
on a 1in
2
pad of 2 oz
copper
b) 125°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2
Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS6294 Rev D(W)