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EX29DS160-90RTCI 参数 Datasheet PDF下载

EX29DS160-90RTCI图片预览
型号: EX29DS160-90RTCI
PDF下载: 下载PDF文件 查看货源
内容描述: 32兆( 4M ×8 / 2M ×16 )的CMOS 3.0伏只,同时操作闪存 [32Mbit(4M x 8/2M x 16) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory]
分类和应用: 闪存
文件页数/大小: 59 页 / 771 K
品牌: EXCELSEMI [ EXCEL SEMICONDUCTOR INC. ]
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E S I  
E S I  
ADVANCED INFORMATION  
Excel Semiconductor inc.  
The device enters the CMOS standby mode when  
cycle and the last cycle with the program data and  
addresses. In this mode, two unlock cycles are  
saved ( or bypassed ).  
CE# and RESET# pins are both held at Vcc  
+0.3V.  
(Note that this is a more restricted voltage range  
than V ) If CE# and RESET# are held at V , but  
IH.  
IH  
Sector Addresses  
not within Vcc+0.3V, the device will be still in the  
standby mode, but the standby current will be  
greater than the CMOS standby current (15uA typi-  
cally). When the device is in the standby mode, only  
The entire memory space of cell array is divided  
into a many of small sectors: 8kbytes x 8 boot sec-  
tors and 64Kbytes x 63 main sectors. In erase  
operation, a single sector, multiple sectors, or the  
entire device (chip erase) can be selected for  
erase. The address space that each sector occu-  
pies is shown in detail in the Table 3-4.  
standard access time (t ) is required for read  
CE  
access, before it is ready for read data. And even if  
the device is deselected by CE# pin during erase or  
programming operation, the device draws active cur-  
rent until the operation is completely done. While the  
device stays in the standby mode, the output is  
placed in the high impedance state, independent of  
the OE# input.  
Accelerated Program Mode  
The device offers accelerated program operations  
through the ACC function. This is one of two func-  
tions provided by the WP#/ACC pin. This function  
is primarily intended to allow faster manufacturing  
The device can enter the deep power-down mode  
where current consumption is greatly reduced down  
to less than 15uA typically by the following three  
ways:  
throughput at the factory. If the system asserts V  
HH  
(8.5~9.5V) on this pin, the device automatically  
enters the previously mentioned Unlock Bypass  
mode, temporarily unprotects any protected sec-  
tors, and uses the higher voltage on the pin to  
reduce the time required for program operations.  
Only two-cycle program command sequences are  
required because the unlock bypass mode is auto-  
matically activated in this acceleration mode. The  
- CMOS standby ( CE#, RESET# = Vcc + 0.3V )  
- During the device reset ( RESET# = Vss + 0.3V )  
- In Autosleep Mode ( after tACC + 30ns )  
Refer to the CMOS DC characteristics Table11 for  
further current specification.  
device returns to the normal operation when V is  
Autosleep Mode  
HH  
removed from the WP#/ACC pin. It should be  
The device automatically enters a deep power-down  
mode called the autosleep mode when addresses  
noted that the WP#/ACC pin must not be at V for  
HH  
operations other than accelerated programming, or  
device damage may result. In addition, the WP#/  
ACC pin must not be left floating or unconnected;  
inconsistent or undesired behavior of the device  
may result.  
remain stable for t  
+30ns. In this mode, current  
ACC  
consumption is greatly reduced ( less than 15uA typ-  
ical ), regardless of CE#, WE# and OE# control sig-  
nals.  
Autoselect Mode  
Writing Commands  
Flash memories are intended for use in applica-  
tions where the local CPU alters memory contents.  
In such applications, manufacturer and device  
identification (ID) codes must be accessible while  
the device resides in the target system ( the so  
called “in-system program”). On the other hand,  
signature codes have been typically accessed by  
raising A9 pin to a high voltage in PROM program-  
mers. However, multiplexing high voltage onto  
address lines is not the generally desired system  
design practice. Therefore, in the ES29DL320  
device an autoselect command is provided to  
allow the system to access the signature codes  
without any high voltage. The conventional A9  
high-voltage method used in the PROM program-  
ers for signature codes are still supported in this  
device.  
To write a command or command sequences to ini-  
tiate some operations such as program or erase, the  
system must drive WE# and CE# to V , and OE# to  
IL  
V . For program operations, the BYTE# pin deter-  
IH  
mines whether the device accepts program data in  
bytes or words. Refer to “BYTE# timings for Write  
Operations” in the Fig. 21 for more information.  
Unlock Bypass Mode  
To reduce more the programming time, an unlock-  
bypass mode is provided. Once a bank enters this  
mode, only two write cycles are required to initiate  
the programming operation instead of four cycles in  
the normal program command sequences which are  
composed of two unlock cycles, program set-up  
7
Rev. 0E May 25, 2006  
ES29DL320  
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