E S I
E S I
ADVANCED INFORMATION
Excel Semiconductor inc.
PHYSICAL DIMENSIONS
48-Ball FBGA (6 x 8 mm)
0.20
(4x)
D1
A
D
H
G F
E
D
C
B
A
6
5
4
7
SE
e
E
E1
3
2
1
6
b
7
SD
B
A1 CORNER INDEX MARK 11
PIN 1 ID.
0.15 M Z A B
0.08 M Z
10
//
0.25
Z
A2
A
0.08
Z
Z
A1
NOTES:
PACKAGE
JEDEC
xFBD 048
N/A
1. Dimensioning and tolerancing per ASME Y14.5M-1994
2. All dimensions are in millimeters.
6.00 mm x8.00 mm PACKAGE
3. Ball position designation per JESD 95-1, SPP-010.
4. e represents the solder ball grid pitch.
5. Symbol “MD” is the ball row matrix size in the “D” direction.
Symbol “ME” is the ball column matrix size in the “E” direct-
ion. N is the maximum number of solder balls for matrix si-
ze MD X ME.
SYMBOL
A
MIN
NOM
MAX
1.10
NOTE
OVERALL THICK
NESS
A1
A2
D
0.21
0.7
0.25
0.76
0.29
0.82
BALL HEIGHT
BODY THICKNESS
BODY SIZE
8.00 BSC
6. Dimension “b” is measured at the maximum ball diameter
in a plane parallel to datum Z.
E
6.00 BSC
5.60 BSC
4.00 BSC
8
BODY SIZE
D1
E1
MD
BALL FOOTPRINT
BALL FOOTPRINT
7. SD and SE are measured with respect to datums A and B
and define the position of the center solder ball in the out-
er row. When there is an odd number of solder balls in the
outer row parallel to the D or E dimension, respectively, SD
or SE = 0.000 when there is an even number of solder balls
in the outer row, SD or SE = e/2
8. “X” in the package variations denotes part is outer qualifi-
cation.
9. “+” in the package drawing indicate the theoretical center
of depopulated balls.
ROW MATRIX SIZED
DIRECTION
ME
6
ROW MATRIX SIZED
DIRECTION
N
48
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
b
0.30
0.35
0.40
0.80 BSC
0.40 BSC
e
SD / SE
SOLDER BALL
PLACEMENT
10. For package thickness A is the controlling dimension.
11. A1 corner to be indentified by chamfer, ink mark, metalli-
zed markings indention or other means.
55
Rev. 0E May 25, 2006
ES29DL320
EXCELSEMI [ EXCEL SEMICONDUCTOR INC. ]
