E S I
E S I
Excel Semiconductor inc.
Document Title
32M Flash Memory
Revision History
Revision Number
Data
Items
1. The preliminary is removed from the datasheet.
2. The Icc3 (max) is changed from 5uA to 10uA.
3. The Icc4 (max) is changed from 5uA to 10uA.
4. The Icc5 (max) is changed from 5uA to 10uA.
Rev. 2A
Dec. 1, 2004
5. The size of FBGA is changed from 8mm x 9mm to 7mm x 8mm.
6. The overall thickness of FBGA , A (max), is changed from 1.20
to 1.10. Therefore, ball height (A1) and body thickness (A2)
also is changed accordingly.
7. The ball diameter of FBGA, b(min), b(nom), b(max), is changed
from 0.25, 0.30, and 0.35 to 0.30, 0.35, and 0.40 respectively.
1. The arrow from Erase Suspend Read to Read is changed to
Sector Erase.
Rev. 2B
Dec. 13, 2004
2. V
(min), 2.3V is added
LKO
Rev. 2C
Rev. 2D
Apr. 1, 2005
Jan. 5, 2005
1. Remove FBGA Package Type.
1. Add RoHS-Compliant Package Option.
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The attached datasheets are provided by Excel Semiconductor.inc (ESI). ESI reserves the right to change the spec-
ifications and products. ESI will answer to your questions about device. If you have any questions, please contact the
ESI office.
59
Rev. 2D Jan 5, 2006
ES29LV320D
EXCELSEMI [ EXCEL SEMICONDUCTOR INC. ]
