EMP213 参数 Datasheet PDF下载

EMP213

UPDATED 05/08/2008

12.5 – 15.5 GHz Power Amplifier MMIC

ASSEMBLY DRAWING

The length of RF wires should be as short as possible. Use at least two 1.0mil gold wires between RF pad

and 50 ohm line and separate the wires to minimize the mutual inductance.

CHIP OUTLINE

Chip Size 1130 x 2250 microns

Chip Thickness: 85

±

15 microns

PAD Dimensions: 100 x 100 microns

All Dimensions in Microns

Specifications are subject to change without notice.

Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085

Phone: 408-737-1711 Fax: 408-737-1868 Web:

www.excelics.com

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Revised May 2008