MP3276
ELECTRICAL CHARACTERISTICS TABLE (CONT’D)
Description
DIGITAL OUTPUTS
(Data Format 2’s Complement)
DB0/SDC–DB11/SDO, STL, STS
Logical “1” Voltage
Logical “0” Voltage
Tristate Leakage
POWER SUPPLIES
Operating Range
V
DD
V
CC
V
EE
Operating Current
I
DD
I
CC
I
EE
Power Dissipation
V
OH
V
OL
I
OZ
4.0
–5
0.4
5
2.4
–5
0.4
5
V
V
µA
Symbol
Min
25
°
C
Typ
Max
Tmin to Tmax
Min
Max
Units
Conditions
C
OUT
=15 pF
I
SOURCE
= 0.5 mA
I
SINK
= 1.6 mA
V
OUT
=GND to V
DD
+4.5
+11.4
–4.75
2
5
1.5
110
+5.5
+16.5
–16.5
7
8
3
200
+4.5
+11.4
–4.75
+5.5
+16.5
–16.5
7
8
3
200
V
V
V
mA
mA
mA
mW
Tested at –11.4 and –16.5 only
NOTES
1
Tester measures code transitions by dithering the voltage of the analog input (V
IN
). The difference between the measured and the
ideal code width is the DNL error. The INL error is the maximum distance (in LSBs) from the best fit line to any transition voltage
2
Guaranteed. Not tested.
3
All channel input pins and ground reference pin have protection which becomes active above
60
V.
4
All digital inputs have diodes to V
DD
and AGND. Input DC currents will not exceed specified limits for any input voltage between GND
and V
DD
.
5
Refin should not vary from Refout by more than
10%
of the nominal value of Refout.
Specifications are subject to change without notice
ABSOLUTE MAXIMUM RATINGS (T
A
= +25
°
C unless otherwise noted)
1, 2
V
CC
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to +16.5 V
V
EE
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to –16.5 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
1 V
Digital Inputs/Outputs
to DGND . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
LOGIC
+0.5 V
Analog Inputs (A
IN
0 – A
IN
31, GND REF)
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
60 V
1
REF OUT . . . . . . . . . . . . . . . . . . . Indefinite short to DGND,
Momentary short to V
CC
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150
°
C
Package Power Dissipation Rating to 75
°
C
PGA, PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1800 mW
Derates above 75
°
C . . . . . . . . . . . . . . . . . . . . . 25 mW/
°
C
Lead Temperature, Soldering . . . . . . . . . . . . 300
°
C, 10 Sec
Storage Temperature (Ceramic) . . . . . . . . –65
°
C to +150
°
C
NOTES:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2
Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies.
All logic inputs have protection diodes
which will protect the device from
short transients outside the supplies of less than 100mA for less than 100
µ
s.
Rev. 4.00
5
EXAR [ EXAR CORPORATION ]
