PT67-21C/L41/TR8
Soldering heat reliability(DIP)
Please refer to the following figure
Soldering Iron
Basic spec is ≦5 sec when 260℃. If temperature is higher , time should be shorter
(+10℃ -1sec ).Power dissipation of Iron should be smaller than 15W ,and
temperature should be controllable. Surface temperature of the device should be
under 230℃.
Rework
1.Customer must finish rework within 5 sec under 245℃
2.The head of iron can not touch copper foil.
3.Twin-head type is preferred.
Everlight Electronics Co., Ltd.
http:\\www.everlight.com
Rev 1.1
Page: 7 of 10
Device No：DTT-067-038
Prepared date：05-02-2003
Prepared by：Jaine Tsai
EVERLIGHT [ EVERLIGHT ELECTRONICS CO., LTD ]
