EUA6019
Thermal Pad Considerations
The thermal pad must be connected to ground. The
package with thermal pad of the EUA6019 requires
special attention on thermal design. If the thermal
design issues are not properly addressed, the EUA6019
will go into thermal shutdown when driving a heavy
load.
The thermal pad on the bottom of the EUA6019 should
be soldered down to a copper pad on the circuit board.
Heat can be conducted away from the thermal pad
through the copper plane to ambient. If the copper plane
is not on the top surface of the circuit board, 8 to 10
vias of 13 mil or smaller in diameter should be used to
thermally couple the thermal pad to the bottom plane.
For good thermal conduction, the vias must be plated
through and solder filled. The copper plane used to
conduct heat away from the thermal pad should be as
large as practical.
If the ambient temperature is higher than 25℃,a larger
copper plane or forced-air cooling will be required to
keep the EUA6019 junction temperature below the
thermal shutdown temperature (150℃). In higher
ambient temperature, higher airflow rate and/or larger
copper area will be required to keep the IC out of
thermal shutdown.
DS6019 Ver 1.1 May. 2007
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EUTECH [ EUTECH MICROELECTRONICS INC ]
