EM6A9160TSA
EtronTech
Table 16. Electrical AC Characteristics
(VDD = 2.5V ± 5%, TA = 0~70 °C)
-4
Symbol
Parameter
Unit
Max.
Min.
tCK
tCH
tCL
Clock cycle time
CL = 3
4
10
ns
tCK
tCK
Clock high level width
Clock low level width
0.45
0.45
0.55
0.55
tDQSCK DQS-out access time from CK,
-0.6
-0.6
0.6
0.6
ns
ns
CK
tAC
Output access time from CK,
CK
tDQSQ
tRPRE
tRPST
tDQSS
DQS-DQ Skew
Read preamble
Read postamble
CK to valid DQS-in
-
0.4
ns
tCK
tCK
tCK
ns
0.9
1.1
0.4
0.6
0.85
1.15
tWPRES DQS-in setup time
0
-
tWPRE
tWPST
tDQSH
tDQSL
DQS write preamble
0.35
-
tCK
tCK
tCK
tCK
DQS write postamble
0.4
0.6
DQS in high level pulse width
DQS in low level pulse width
0.4
0.6
0.4
0.6
Fast slew rate
Slow slew rate
Fast slew rate
Slow slew rate
0.6
-
tIS
tIH
Address and Control input setup time
Address and Control input hold time
0.7
-
ns
0.6
-
0.7
-
tDS
DQ & DM setup time to DQS
DQ & DM hold time to DQS
Clock half period
0.4
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tDH
0.4
-
tHP
tCLMIN or tCHMIN
-
tQH
DQ/DQS output hold time from DQS
Row cycle time
tHP - tQHS
-
tRC
52
70
-
tRFC
tRAS
tRCD
tRP
Refresh row cycle time
Row active time
-
36
70K
Active to Read or Write Delay
Row precharge time
16
-
-
-
-
-
16
tRRD
tWR
Row active to Row active delay
Write recovery time
12
12
tMRD
tCCD
tDAL
tXSRD
tPDEX
tREFI
tIPW
tDIPW
Mode register set cycle time
Col. Address to Col. Address delay
2
tCK
tCK
tCK
tCK
ns
µs
ns
ns
1
Auto precharge write recovery + Precharge time
Self refresh exit to read command delay
Power down exit time
7
-
200
tCK + tIS
-
-
-
15.6
-
Refresh interval time
Cntrol and Address input pulse width
DQ & DM input pulse width (for each input)
2.2
1.75
-
tHZ
Data-out high-impedance window from CK,
-
0.7
ns
CK
tLZ
Data-out low-impedance window from CK,
Data Hold Skew Factor
-0.7
-
0.7
ns
ns
CK
tQHS
tDSS
tDSH
tWTR
tXSNR
0.4
DQS falling edge to CK rising – setup time
DQS falling edge to CK rising – hold time
Internal Write to Read command delay
Exit Self-Refresh to non-Read command
0.2
0.2
2
-
-
-
-
tCK
tCK
tCK
ns
75
Etron Confidential
12
Rev. 1.1
Aug. 2009