TLV9001, TLV9002, TLV9004
SBOS833A –OCTOBER 2017–REVISED DECEMBER 2017
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
0
MAX
UNIT
V
Supply voltage ([V+] – [V–])
6
(V+) + 0.5
(V+) – (V–) + 0.2
10
Common-mode
Voltage(2)
(V–) – 0.5
V
Signal input pins
Differential
V
Current(2)
–10
–55
–65
mA
mA
°C
°C
°C
Output short-circuit(3)
Operating, TA
Junction, TJ
Continuous
150
150
150
Storage, Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be
current limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.
6.2 ESD Ratings
VALUE
±2000
±1000
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
5.5
UNIT
V
VS
TA
Supply voltage
1.8
Specified temperature
–40
125
°C
6.4 Thermal Information: TLV9002
TLV9002
THERMAL METRIC(1)
D (SOIC)
8 PINS
147.4
94.3
UNIT
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
89.5
Junction-to-top characterization parameter
Junction-to-board characterization parameter
47.3
ψJB
89
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics application report.
6
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
Product Folder Links: TLV9001 TLV9002 TLV9004
ETC [ ETC ]
