ESMT
M13S2561616A (2K)
Operation Temperature Condition -40°C~85°C
PACKING DIMENSIONS
66-LEAD
TSOP(II)
DDR DRAM(400mil)
Symbol
Dimension in inch
Dimension in mm
Min
Norm
Max
Min
Norm
Max
1.2
A
A1
A2
b
0.047
0.006
0.041
0.015
0.013
0.008
0.006
0.002
0.037
0.009
0.009
0.005
0.0047
0.004
0.039
0.05
0.95
0.22
0.22
0.12
0.12
0.1
1
0.15
1.05
0.38
0.33
0.21
0.16
b1
c
0.012
0.3
c1
D
0.005
0.127
22.22 BSC
0.71 REF
11.76
0.875 BSC
0.028 REF
0.463
ZD
E
0.455
0.016
0.471
0.024
11.56
0.4
11.96
0.6
E1
e
0.400 BSC
0.026 BSC
0.02
10.16 BSC
0.65 BSC
0.5
L
L1
θ°
0.031 REF
0.80 REF
0°
8°
0°
8°
θ1°
10°
15°
20°
10°
15°
20°
Elite Semiconductor Memory Technology Inc.
Publication Date : May 2010
Revision : 1.2
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