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M12L32162A_0712 参数 Datasheet PDF下载

M12L32162A_0712图片预览
型号: M12L32162A_0712
PDF下载: 下载PDF文件 查看货源
内容描述: 1米x 16Bit的X 2Banks同步DRAM [1M x 16Bit x 2Banks Synchronous DRAM]
分类和应用: 动态存储器
文件页数/大小: 28 页 / 688 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
SIMPLIFIED TRUTH TABLE  
COMMAND  
M12L32162A  
Operation Temperature Condition -40°C~105°C  
A11  
CKEn-1 CKEn CS RAS CAS  
DQM BA A10/AP  
Note  
WE  
L
A9~A0  
OP CODE  
Register  
Refresh  
Mode Register Set  
Auto Refresh  
H
H
H
H
X
H
L
L
L
L
L
L
L
L
L
X
X
X
X
1,2  
3
3
H
X
Bank Active & Row Addr.  
X
L
H
L
H
V
V
Row Address  
Column  
4
Auto Precharge Disable  
L
Read &  
X
X
H
H
Address  
Column Address  
4,5  
Auto Precharge Enable  
Auto Precharge Disable  
H
L
(A0~A7)  
Column  
Address  
(A0~A7)  
4
Write & Column  
Address  
H
L
H
L
L
X
V
Auto Precharge Enable  
H
4,5  
Burst Stop  
Precharge  
H
H
X
X
L
L
H
L
H
H
L
L
X
X
X
6
4
4
Bank Selection  
Both Banks  
V
X
L
H
X
H
L
X
H
L
X
V
X
X
H
X
V
X
X
H
X
V
X
X
H
X
V
X
V
X
X
H
X
V
Clock Suspend or  
Active Power Down  
Entry  
Exit  
H
L
L
H
L
X
X
X
X
X
Entry  
H
Precharge Power Down Mode  
H
L
Exit  
L
H
X
V
X
DQM  
H
H
H
X
X
7
H
L
X
H
X
H
No Operation Command  
X
(V= Valid, X= Don’t Care, H= Logic High , L = Logic Low)  
Note:  
1. OP Code: Operation Code  
A0~ A11, BA: Program keys.(@MRS)  
2. MRS can be issued only at both banks precharge state.  
A new command can be issued after 2 clock cycle of MRS.  
3. Auto refresh functions are as same as CBR refresh of DRAM.  
The automatical precharge without row precharge command is meant by “Auto”.  
Auto refresh can be issued only at both banks idle state.  
4. BA: Bank select address.  
If “Low”: at read, write, row active and precharge, bank A is selected.  
If “High”: at read, write, row active and precharge, bank B is selected.  
If A10/AP is “High” at row precharge, BA ignored and both banks are selected.  
5. During burst read or write with auto precharge, new read/write command can not be issued.  
Another bank read /write command can be issued after the end of burst.  
New row active of the associated bank can be issued at tRP after the end of burst.  
6. Burst stop command is valid at every burst length.  
7. DQM sampled at positive going edge of a CLK masks the data-in at the very CLK (Write DQM latency is 0), but  
makes  
Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Dec. 2007  
Revision : 1.2 10/28