AD8356A-LEG 参数 Datasheet PDF下载

ESMT

Functional Block Diagram

AD8356A

Available Package

Package Type

7x7 48L QFN

7x7 48L E-LQFP

Device No.

AD8356A

θ

ja

(℃/W)

23.5

23.8

Ψ

jt

(℃/W)

1.6

1.8

θ

jc

(℃/W)

12.5

15.8

Exposed Thermal Pad

Yes (Note3)

Note3：The thermal pad is at the bottom of package. To optimize the performance of thermal dissipation,

solder the thermal pad to PCB’s ground plane is suggested.

Elite Semiconductor Memory Technology Inc.

Publication Date: May. 2007

Revision: 1.3

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