Ericsson Internal
E
EPETSCH
PROD. SPECIFICATION MECHANICAL
2 (4)
Prepared (also subject responsible if other)
No.
5/1301-BMR 662 Uen
20
Technical Specification
Approved
Checked
Date
Rev
Reference
EN/LZT 146 420 R3A March 2014
PKB 4000A series Direct Converters
Input 36-72 V, Output up to 30 A / 125 W
EAB/FJB/GM [Natalie J]
See §1
2010-01-18
A
© Ericsson AB
Soldering Information — Through Hole Mounting
Delivery Package Information, Through Hole
Mounting Version
The through hole mount version of the product is intended for
manual or wave soldering. When wave soldering is used, the
temperature on the pins is specified to maximum 270°C for
maximum 10 seconds.
The products are delivered in antistatic clamshell.
Clamshell Specifications
Material
PET with antistatic coated
106 < Ohm/square < 1012
The clamshells are not bake-able.
20 products/clamshell
A maximum preheat rate of 4°C/s and a temperature of max
+150°C is suggested. When soldering by hand, care should
be taken to avoid direct contact between the hot soldering
iron tip and the pins for more than a few seconds in order to
prevent overheating.
Surface resistance
Bake ability
Clamshell capacity
Clamshell thickness
Box capacity
20 mm [0.787 inch]
100 products (5 full trays/box)
130 g empty, 530 g full tray
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
Clamshell weight
Delivery Package Information, Surface Mount
Version
The surface mount versions of the products are delivered in
antistatic injection molded trays (Jedec design guide 4.10D
standard.
Tray Specifications
Material
PPE, Antistatic
Surface resistance
105 < Ohm/square < 1012
The trays can be baked at maximum
125°C for 48 hours
Bakability
Tray capacity
Tray thickness
Box capacity
Tray weight
20 products/tray
13.4 mm [0.528 inch]
100 products (5 full trays/box)
110 g empty, 530 g full tray
Non-Dry Pack Information
The through hole mount version of product is delivered in
non-dry packing clamshells.
Dry Pack Information
The surface mount versions of the products are delivered in
trays These inner shipment containers are dry packed in
standard moisture barrier bags according to IPC/JEDEC
standard J-STD-033 (Handling, packing, shipping and use of
moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
ERICSSON [ ERICSSON ]
