Ericsson Internal
E
EPETSCH
PROD. SPECIFICATION MECHANICAL
1 (4)
Prepared (also subject responsible if other)
No.
5/1301-BMR 662 Uen
19
Technical Specification
Approved
Checked
Date
Rev
Reference
EN/LZT 146 420 R3A March 2014
PKB 4000A series Direct Converters
Input 36-72 V, Output up to 30 A / 125 W
EAB/FJB/GM [Natalie J]
See §1
2010-01-18
A
© Ericsson AB
Soldering Information - Surface Mounting
The surface mount version of the product is intended for
convection or vapor phase reflow SnPb and Pb-free
processes. To achieve a good and reliable soldering result,
make sure to follow the recommendations from the solder
paste supplier, to use state-of-the-art reflow equipment and
Peak Product Temperature Requirements
Pin number 2 is chosen as reference location for the
maximum (peak) allowed product temperature (TP) since this
reflow profiling techniques as well as the following guidelines. will likely be the warmest part of the product during the reflow
process.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
To avoid damage or performance degradation of the product,
product and the host board. The cleaning residues may affect the reflow profile should be optimized to avoid excessive
long time reliability and isolation voltage.
heating. A sufficiently extended preheat time is recommended
to ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
Minimum Pin Temperature Recommendations
Pin number 4 is chosen as reference location for the minimum
pin temperature recommendations since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
Pin 2 for measurement of maximum
Peak product reflow temperature, TPIN
During reflow, TP must not exceed +225°C at any time.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, TP must not exceed +260°C at any time.
Temperature
Pin 4 for measurement of minimum
Solder joint temperature, TPIN
Ramp-up
TP
Ramp-down
(cooling)
TL
SnPb solder processes
Reflow
For SnPb solder processes, a pin temperature (TPIN) in excess
of the solder melting temperature, (TL, +183°C for Sn63/Pb37)
for more than 30 seconds, and a peak temperature of +210°C
is recommended to ensure a reliable solder joint.
Preheat
Time 25 °C to peak
25 °C
Time
Lead-free (Pb-free) solder processes
Reflow process specifications
Average ramp-up rate
Sn/Pb eutectic
3°C/s max
Pb-free
For Pb-free solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature (TL, +217 to +221°C
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of +235°C on all solder joints is
3°C/s max
Solder melting
TL
+183°C
+221°C
temperature (typical)
recommended to ensure a reliable solder joint.
Minimum time above TL
30 s
30 s
Minimum pin temperature TPIN
Peak product temperature TP
Average ramp-down rate
Time 25°C to peak
+210°C
+235°C
+225°C
+260°C
6°C/s max
6 minutes max
6°C/s max
8 minutes max
ERICSSON [ ERICSSON ]
