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PBL38571 参数 Datasheet PDF下载

PBL38571图片预览
型号: PBL38571
PDF下载: 下载PDF文件 查看货源
内容描述: 大电流语音和线路接口电路 [High current Speech and Line interface Circuit]
分类和应用:
文件页数/大小: 14 页 / 264 K
品牌: ERICSSON [ ERICSSON ]
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PBL 385 71  
Radiointerferenceoriginating  
from mobile phones  
V and I protection  
SIOV  
5 - 10  
Line  
in  
The problem with direct radiated RFI has  
accentuatedlately becauseofthegrowing  
numbers of mobile and especially pocket  
telephones. Thus it is today rather com-  
monthataRFtransmitterwithoutputpower  
of several watts in form of a mobile  
telephone is placed quite close to an ana-  
log telephone. There is a simultaneous  
even bigger problem coming from these  
portable phones of digital time-multiplex  
typeliketheGSM.TheGSMsignalconsists  
Plastic  
enclosure  
The  
electronic  
circuitry  
C10  
Metallic shield, sprayed or foil  
RF radiating measuring sheet.  
RF-gen.  
Figure 21. How to measure the RFI pickup.  
via tracks on the board (See fig. 31).  
13). Connect components as close to  
the IC as possible. Connect  
of 900 MHz carrier that is transmitted in 7). Balanced points like a differential  
especially decoupling capacitors  
close to the ground pin of the IC.  
short signal bursts 1/8 of time and with a  
repetition frequency of slightly higher than  
200 Hz. This signal will be directly radiated  
to all parts in a conventional telephone set.  
All unlinear elements as most of the  
microphone input may have to be  
decoupled differentially between  
the inputs and ”common mode” to  
common ground each input  
separately.  
The terminal circuits from Ericsson  
Components are manufactured in IC  
processes with large internal capacitors  
onthechiptocounteract RFIdisturbanses  
in every possible way.  
The simplest method to test the  
susceptibility of an apparatus to RFI is to  
take a portable phone of an actual type  
and move it transmitting across the phone,  
cables and handset. Measure the signal  
at earphone output aswell as on the line.  
Finally; to design an ordinary analog  
telephone to fullfil todays requirements is  
not a low frequency but a high frequency  
task.  
semiconductors will envelope detect this 8). A virtual ground may have to be  
signal and thus feed the 200 Hz signal with  
harmonics into all points of the telephone.  
The methode to counteract this problem is  
the same as before with a difference that it 9). Think that even overvoltage and  
has to be done with much more precision.  
The principle is to attenuate the HF signal  
toalevelwherethedetected200Hzsignal 10). Shields that are connected to the  
is below a disturbing level especially at  
internal ground can be of help.  
high sensitivepointslikeatthe microphone 11). Control that no already detected  
created into which all outgoing  
cables are decoupled in order to  
bypass the RF- signal. See fig. 31.  
overcurrent protectors can be  
acting as HF detectors.  
input.  
signals from for ex. dialler enter the  
speech circuit via the mute  
function.  
Following aspects ought to be considered:  
12). Try to reach a high packing density  
on the PC-board.  
1). Do not make any points in the  
circuitry more high impedive than  
necessary.  
2). Keep all cables, wires and tracks  
on PC-board as short as possible.  
3). Decouple all sensitive points to an  
internal ground with capacitors  
especially the microphone amplifier  
input.  
Not like  
this  
Like this  
4). To include series elements like  
resistors and inductors in all long  
wires or cables that could act as  
aerials. For ex. microphone cable,  
earphone cable, cable to the  
telephone network, mute wire and  
cable to the keypad.  
Figure 22. RFI elimination at PCB layout level.  
Microphone  
5). Comprehend that it is a question of  
a HF- design,so that all used  
decoupling components are well  
suited to the frequencies at hand.  
(up to several GHz).  
Earphone  
Line  
6). HF- design includes also that  
tracks on the PC-board act as  
inductors and therefore it is the  
more important that the decoupling  
capacitors are placed directly  
between the actual points and not  
Resistors  
or  
inductors  
Virtual ground  
Common ground of the telephone  
Figure 23. RFI elimination in the wiring.  
13