Ericsson Internal
E
EPETSCH
PRODUCT SPEC.
1 (5)
Prepared (also subject responsible if other)
No.
5/1301 - BMR 456 Uen
46
Technical Specification
BMR456 series Fully regulated AdvCahnecckeed d Bus Converters
Approved
Date
Rev
Reference
EAB/FJB/GM [Ksenia Harrisen]
See §1
2012-06-11
C
1/28701-FGCJ101 1823 revD February 2013
© Ericsson AB
Input 36-75 V, Output up to 39 A / 468 W
Soldering Information - Surface Mounting
Lead-free (Pb-free) solder processes
The surface mount product is intended for forced convection or For Pb-free solder processes, a pin temperature (TPIN) in
vapor phase reflow soldering in SnPb and Pb-free processes.
excess of the solder melting temperature (TL, 217 to 221°C for
SnAgCu solder alloys) for more than 60 seconds and a peak
temperature of 245°C on all solder joints is recommended to
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a sufficiently ensure a reliable solder joint.
extended preheat time to ensure an even temperature across
the host PWB and it is also recommended to minimize the time
in reflow.
Maximum Product Temperature Requirements
Top of the product PWB near pin 2 is chosen as reference
location for the maximum (peak) allowed product temperature
(TPRODUCT) since this will likely be the warmest part of the
product during the reflow process.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may affect
long time reliability and isolation voltage.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
General reflow process specifications
Average ramp-up (TPRODUCT
SnPb eutectic
3°C/s max
Pb-free
)
3°C/s max
Typical solder melting (liquidus)
temperature
TL
183°C
221°C
During reflow TPRODUCT must not exceed 225 °C at any time.
Minimum reflow time above TL
Minimum pin temperature
Peak product temperature
60 s
60 s
Pb-free solder processes
TPIN
210°C
235°C
For Pb-free solder processes, the product is qualified for MSL 3
according to IPC/JEDEC standard J-STD-020C.
TPRODUCT 225°C
6°C/s max
260°C
Average ramp-down (TPRODUCT
)
6°C/s max
8 minutes
Maximum time 25°C to peak
6 minutes
During reflow TPRODUCT must not exceed 260 °C at any time.
Dry Pack Information
Temperature
TPRODUCT maximum
TPIN minimum
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount devices).
Pin
profile
TL
Product
profile
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case the
products have been stored in an uncontrolled environment and
no longer can be considered dry, the modules must be baked
according to J-STD-033.
Time in
reflow
Time in preheat
/ soak zone
Time 25°C to peak
Time
Thermocoupler Attachment
Minimum Pin Temperature Recommendations
Top of PWB near pin 2 for measurement of maximum product
temperature, TPRODUCT
Pin number 5 chosen as reference location for the minimum pin
temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (TPIN) in excess
of the solder melting temperature, (TL, 183°C for Sn63Pb37) for
more than 60 seconds and a peak temperature of 220°C is
recommended to ensure a reliable solder joint.
For dry packed products only: depending on the type of solder
paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be used,
if the products are kept in a controlled environment (dry pack
handling and storage) prior to assembly.
Pin 5 for measurement of minimum pin (solder joint) temperature, TPIN
ERICSSON [ ERICSSON ]
