Ericsson Internal
E
EPETSCH
PRODUCT SPEC.
2 (5)
Prepared (also subject responsible if other)
No.
5/1301 - BMR 456 Uen
47
Technical Specification
BMR456 series Fully regulated AdvCahnecckeed d Bus Converters
Approved
Date
Rev
Reference
EAB/FJB/GM [Ksenia Harrisen]
See §1
2012-06-11
C
1/28701-FGCJ101 1823 revD February 2013
© Ericsson AB
Input 36-75 V, Output up to 39 A / 468 W
Soldering Information - Hole Mounting
The hole mounted product is intended for plated through hole
mounting by wave or manual soldering. The pin temperature is
specified to maximum to 270°C for maximum 10 seconds.
A maximum preheat rate of 4°C/s and maximum preheat
temperature of 150°C is suggested. When soldering by hand,
care should be taken to avoid direct contact between the hot
soldering iron tip and the pins for more than a few seconds in
order to prevent overheating.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
Delivery Package Information
The products are delivered in antistatic injection molded trays
(Jedec design guide 4.10D standard) and in antistatic trays.
Tray Specifications – SMD
Material
Antistatic PPE
105 < Ohm/square < 1012
Surface resistance
The trays can be baked at maximum
125°C for 48 hours
Bakability
Tray thickness
Box capacity
Tray weight
14.50 mm 0.571 [ inch]
20 products (2 full trays/box)
125 g empty, 574 g full tray
JEDEC standard tray for 2x5 = 10 products.
All dimensions in mm [inch]
Tolerances: X.x ±0.26 [0.01], X.xx ±0.13 [0.005]
Note: pick up positions refer to center of pocket.
See mechanical drawing for exact location on product.
ERICSSON [ ERICSSON ]
