CeraDiodes
High-speed series
5.7
Placement of components on circuit board
It is of advantage to place the components on the board before soldering so that their two termi-
nals do not enter the solder oven at different times. Ideally, both terminals should be wetted si-
multaneously.
5.8
Soldering caution
Sudden heating or cooling of the component results in thermal destruction by cracks.
An excessively long soldering time or high soldering temperature results in leaching of the out-
er electrodes, causing poor adhesion due to loss of contact between electrodes and termina-
tion.
Avoid manual soldering with a soldering iron.
Wave soldering must not be applied for CeraDiodes designated for reflow soldering only.
Keep to the recommended down-cooling rate.
5.9
Standards
CECC 00802
IEC 60068-2-58
IEC 60068-2-20
JEDEC J-STD-020D
Please read Cautions and warnings and
Important notes at the end of this document.
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EPCOS [ EPCOS ]
