CeraDiodes
High-speed series
4
Solderability tests
Test
Standard Test conditions /
Sn-Pb soldering
Test conditions /
Pb-free soldering
Criteria / test results
Wettability
IEC
Immersion in
Immersion in
Covering of 95%
60068-2-58 60/40 SnPb solder
Sn96.5Ag3.0Cu0.5
of end termination,
using non-activated solder using non- or checked by visual
flux at 215 ±3 °C for low activated flux
inspection
3 ±0.3 s
at 245 ±5 °C
for 3 ±0.3 s
Leaching
resistance
IEC
Immersion in
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
No leaching of
contacts
60068-2-58 60/40 SnPb
solder using
mildly activated flux low activated flux
without preheating
at 255 ±5 °C
for 10 ±1 s
without preheating
at 255 ±5 °C
for 10 ±1 s
Tests of
IEC
Immersion in
Immersion in
Capacitance change:
resistance to
soldering heat
for SMDs
60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5
at 260 °C for 10 s at 260 °C
ꢀ15% ≤∆C ≤15%
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on the substrate.
As single chip
As mounted on substrate
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 22
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