epc120
Reflow Solder Profile
For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for
Pb-free assembly for both types of packages. The peak soldering t emperature (TL) should not exceed +260°C for a maximum of 4 sec.
Packaging Information (all measures in mm)
Tape & Reel Information
The devices are mounted on embossed tape for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13 inch)
reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indicate the
tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association (EIA) standard
481-1, 481-2, 481-3.
CSP6 Tape
QFN16 Tape
Pin 1
Pin 1
4
8
Figure 26: CSP10 and QFN16 Tape Dimensions
ESPROS Photonics AG does not guarantee that there are no empty cavities. Thus, the pick-and-place machine should check the presence of
a chip during picking.
Ordering Information
Type
Package
RoHS compliance
Packaging
Method
epc120-CSP10
epc120-QFN16
CSP10
QFN16
Yes
Yes
Reel
Reel
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
26
Datasheet epc12x - V2.1
www.espros.ch
EPC [ ESPROS PHOTONICS CORP ]
