EM47FM3288SBA
AC Operating Test Characteristics
(VDD, VDDQ=1.5V±0.075V)
Speed Bin
-125 (DDR3-1600)
-150 (DDR3-1333)
Notes
Symbol
CL-nRCD-nRP
Parameter
11-11-11
9-9-9
Max.
Units
nCK
Min.
Max.
Min.
ODT to power-down entry/ exit
latency
tANPD
WL–1
-
WL–1
-
ODTLon
ODTLoff
ODT turn on latency
ODT turn off latency
WL–2
WL–2
WL–2
WL–2
WL–2
WL–2
WL–2
WL–2
nCK
nCK
ODT latency for changing from
RTT_Nom to RTT_WR
ODTLcnw
ODTLcwn4
ODTLcwn8
WL–2
WL–2
WL–2
WL–2
nCK
nCK
nCK
ODT latency for changing from
RTT_WR to RTT_Nom (BC4)
4+ODTLoff
6+ODTLoff
4+ODTLoff
6+ODTLoff
-
-
-
-
ODT latency for changing from
RTT_WR to RTT_Nom (BL8)
Note 1: Actual value dependant upon measurement level definitions which are TBD.
Note 2: Commands requiring a locked DLL are: READ (and READA) and synchronous ODT commands.
Note 3: The max values are system dependent.
Note 4: WR as programmed in mode register.
Note 5: Value must be rounded-up to next higher integer value.
Note 6: There is no maximum cycle time limit besides the need to satisfy the refresh interval, tREFI.
Note 7: ODT turn on time (min.) is when the device leaves high impedance and ODT resistance begins to turn
on. ODT turn on time (max.) is when the ODT resistance is fully on. Both are measured from ODTLon.
Note 8: ODT turn-off time (min.) is when the device starts to turn-off ODT resistance. ODT turn-off time (max.)
is when the bus is in high impedance. Both are measured from ODTLoff.
Note 9: tWR is defined in ns, for calculation of tWRPDEN it is necessary to round up tWR / tCK to the next
integer.
Note 10: WR in clock cycles as programmed in MR0.
Note 11: The maximum read postamble is bound by tDQSCK(min) plus tQSH(min) on the left side and
tHZ(DQS)max on the right side.
Note 12: Output timing deratings are relative to the SDRAM input clock. When the device is operated with input
clock jitter, this parameter needs to be derated by TBD.
Note 13: Value is only valid for RON34.
Note 14: Single ended signal parameter. Refer to the section of tLZ(DQS), tLZ(DQ), tHZ(DQS), tHZ(DQ) Notes
for definition and measurement method.
Note 15: tREFI depends on operating case temperature (Tc).
Note 16: tIS(base) and tIH(base) values are for 1V/ns command/ addresss single-ended slew rate and 2V/ns
CK, /CK differential slew rate, Note for DQ and DM signals, VREF(DC) = VREFDQ(DC). For input only pins
except RESET, VREF(DC) = VREFCA(DC). See Address / Command Setup, Hold and Derating section.
Note 17: tDS(base) and tDH(base) values are for 1V/ns DQ single-ended slew rate and 2V/ns DQS, /DQS
differential slew rate. Note for DQ and DM signals, VREF(DC)= VREFDQ(DC). For input only pins except
RESET, VREF(DC) = VREFCA(DC). See Data Setup, Hold and and Slew Rate Derating section.
Jul. 2012
24/40
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