EN29LV320A
COMMAND DEFINITIONS
The operations of the device are selected by one or more commands written into the command
register. Commands are made up of data sequences written at specific addresses via the
command register. The sequences for the specified operation are defined in the Command
Definitions table (Table 9). Incorrect addresses, incorrect data values or improper sequences will
reset the device to Read Mode.
Table 9. EN29LV320A Command Definitions
Bus Cycles
3rd Cycle 4th Cycle
Command
Sequence
1st Cycle
2nd Cycle
5th Cycle
6th Cycle
Addr
Data
RD
F0
Addr
Data
Addr
Data
Addr Data
Addr
Data
Addr
Data
Read
Reset
1
1
RA
xxx
000
100
000
200
7F
Word
555
2AA
555
555
Manufacturer
ID
1C
7F
1C
4
AA
55
90
Byte
AAA
AAA
Word
Byte
555
2AA
555
2AA
555
x01
x02
x01
x02
22F6
Device ID
Top Boot
4
4
AA
AA
55
55
90
90
AAA
555
AAA
555
F6
Word
Byte
22F9
F9
Device ID
Bottom Boot
AAA
555
AAA
2AA
(SA)
X02
(SA)
X04
00
01
00
01
Word
555
555
Sector Protect
Verify
4
AA
55
55
90
Byte
AAA
555
555
AAA
555
Word
2AA
Program
4
3
AA
AA
A0
20
PA
PD
Byte
AAA
555
555
AAA
555
Word
2AA
Unlock Bypass
55
Byte
AAA
555
PA
AAA
Unlock Bypass Program
Unlock Bypass Reset
2
2
XXX A0
XXX 90
PD
XXX 00
Word
555
AA
2AA
55
555
555
2AA
555
Chip Erase
6
6
80
80
AA
AA
55
55
10
30
Byte
Word
Byte
AAA
555
AAA
555
AAA
AAA
555
AAA
555
2AA
555
AAA
555
AA
2AA
55
Sector Erase
SA
AAA
555
Sector Erase Suspend
Sector Erase Resume
1
1
xxx
B0
30
xxx
55
Word
Byte
CFI Query
1
98
AA
Address and Data values indicated are in hex. Unless specified, all bus cycles are write cycles
RA = Read Address: address of the memory location to be read. This is a read cycle.
RD = Read Data: data read from location RA during Read operation. This is a read cycle.
PA = Program Address: address of the memory location to be programmed. X = Don’t-Care
PD = Program Data: data to be programmed at location PA
SA = Sector Address: address of the Sector to be erased or verified. Address bits A20-A12 uniquely select any Sector.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
19
Rev. B, Issue Date: 2007/07/17