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EN25S20-75WIP 参数 Datasheet PDF下载

EN25S20-75WIP图片预览
型号: EN25S20-75WIP
PDF下载: 下载PDF文件 查看货源
内容描述: 2兆位1.8V串行闪存与4K字节扇区制服 [2 Megabit 1.8V Serial Flash Memory with 4Kbyte Uniform Sector]
分类和应用: 闪存
文件页数/大小: 34 页 / 564 K
品牌: EON [ EON SILICON SOLUTION INC. ]
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EN25S20  
the time duration of t  
RES1  
(See AC Characteristics) the device will resume normal operation and other  
instructions will be accepted. The CS# pin must remain high during the t  
time duration.  
RES1  
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by  
driving the CS# pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The Device  
ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in  
Figure 17. The Device ID value for the EN25S20 are listed in Table 5. The Device ID can be read  
continuously. The instruction is completed by driving CS# high.  
When Chip Select (CS#) is driven High, the device is put in the Stand-by Power mode. If the device  
was not previously in the Deep Power-down mode, the transition to the Stand-by Power mode is  
immediate. If the device was previously in the Deep Power-down mode, though, the transition to the  
Standby Power mode is delayed by t  
, and Chip Select (CS#) must remain High for at least t  
RES2 RES2  
(max), as specified in Table 11. Once in the Stand-by Power mode, the device waits to be selected, so  
that it can receive, decode and execute instructions.  
Except while an Erase, Program or Write Status Register cycle is in progress, the Release from Deep  
Power-down and Read Device ID (RDI) instruction always provides access to the 8bit Device ID of the  
device, and can be applied even if the Deep Power-down mode has not been entered.  
Any Release from Deep Power-down and Read Device ID (RDI) instruction while an Erase, Program or  
Write Status Register cycle is in progress, is not decoded, and has no effect on the cycle that is in  
progress.  
Figure 16. Release Power-down Instruction Sequence Diagram  
Figure 17. Release Power-down / Device ID Instruction Sequence Diagram  
This Data Sheet may be revised by subsequent versions  
or modifications due to changes in technical specifications.  
©2004 Eon Silicon Solution, Inc., www.eonssi.com  
20  
Rev. H, Issue Date: 2011/11/07  
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