EN25Q128
Revisions List
Revision No Description
Date
A
Initial Release
2009/07/13
1. Update Page programming, Sector, Block and Chip erase time (typ.)
and (max.) parameter on page 1 and 50.
(1). Page programming: from 1.3ms to 0.8ms (typ.)
, from 5ms to 3ms (max.)
(2). Sector erase: from 0.06s to 0.05s (typ.)
, from 0.3s to 0.25s (max.)
B
2009/09/03
(3). Block erase: from 0.25s to 0.2s (typ.)
, from 2s to 1.6s (max.)
(4). Chip erase: from 50s to 45s (typ.)
, from 100s to 90s (max.)
2. Add Figure 23. Write Suspend/Resume Flow on page 39
1. Add VDFN 8 ( 6 x 8 mm ) dimension on page 55.
2. Modify Table 10. DC Characteristics I
(Standby) and I
(Deep
CC2
C
D
2009/10/21
2010/02/04
CC1
Power-down) Current from 5µA to 20µA on page 49.
1. Add 24-ball Ball Grid Array (6 x 8 mm) package option.
2. Remove Write Suspend and Write Resume information.
3. Modify Software Reset Latency from 20µs to 28µs on page 47.
1. Update AC Characteristics in Table 11 on page 47.
(1). Page Programming time from 3ms to 5ms (max.)
(2). Sector Erase time from 0.25s to 0.3s (max.)
(3). Block Erase time from 1.6s to 2s (max.)
1. Rename 38h command from Enable Quad I/O (EQIO) to Enable Quad
Peripheral Interface mode (EQPI).
2. Revise the speed of Quad SPI from 80MHz to 50MHz.
1. Update Write Status Register Cycle Time from 10 (typ.) /15 (max.) ms to 15
(typ.) / 50 (max.) ms on page 47.
E
F
2010/04/19
2011/01/10
2011/04/19
G
2. Remove the package option of 8 contact VDFN (5x6mm).
3. Rename 24 Ball package from BGA to TFBGA.
1. Add the note “5. This flow cannot release the device from Deep power
down mode.” on page 19.
2. Correct the typo of 6 dummy clocks for EBh command on page 29.
3. Update Chip Erase Time (max.) from 90s to 140s on page 47.
Add Automotive (-40°C to +125°C) grade temperature option.
Add VDFN 8 ( 5 x 6 mm ) package option.
H
2011/07/01
I
J
2011/09/06
2011/09/19
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.eonssi.com
57
Rev. J, Issue Date: 2011/09/19
EON [ EON SILICON SOLUTION INC. ]
