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EN25Q128-104FIP 参数 Datasheet PDF下载

EN25Q128-104FIP图片预览
型号: EN25Q128-104FIP
PDF下载: 下载PDF文件 查看货源
内容描述: 128兆位串行闪存与4K字节扇区制服 [128 Megabit Serial Flash Memory with 4Kbyte Uniform Sector]
分类和应用: 闪存
文件页数/大小: 57 页 / 1077 K
品牌: EON [ EON SILICON SOLUTION INC. ]
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EN25Q128  
Figure 18. Sector Erase Instruction Sequence Diagram  
Block Erase (BE) (D8h)  
The Block Erase (BE) instruction sets to 1 (FFh) all bits inside the chosen block. Before it can be  
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write  
Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).  
The Block Erase (BE) instruction is entered by driving Chip Select (CS#) Low, followed by the in-  
struction code, and three address bytes on Serial Data Input (DI). Any address inside the Block (see  
Table 2) is a valid address for the Block Erase (BE) instruction. Chip Select (CS#) must be driven Low  
for the entire duration of the sequence.  
The instruction sequence is shown in Figure 19. Chip Select (CS#) must be driven High after the eighth  
bit of the last address byte has been latched in, otherwise the Block Erase (BE) instruction is not  
executed. As soon as Chip Select (CS#) is driven High, the self-timed Block Erase cycle (whose du-  
ration is t ) is initiated. While the Block Erase cycle is in progress, the Status Register may be read to  
BE  
check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-  
timed Block Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is  
completed, the Write Enable Latch (WEL) bit is reset.  
A Block Erase (BE) instruction applied to a block which is protected by the Block Protect (BP3, BP2,  
BP1, BP0) bits (see Table 3) is not executed.  
The instruction sequence is shown in Figure 19.1 while using the Enable Quad Peripheral Interface mode  
(EQPI) (38h) command.  
This Data Sheet may be revised by subsequent versions  
or modifications due to changes in technical specifications.  
©2004 Eon Silicon Solution, Inc., www.eonssi.com  
35  
Rev. J, Issue Date: 2011/09/19  
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