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EDE5104AGSE-5C-E 参数 Datasheet PDF下载

EDE5104AGSE-5C-E图片预览
型号: EDE5104AGSE-5C-E
PDF下载: 下载PDF文件 查看货源
内容描述: 512M位DDR2 SDRAM [512M bits DDR2 SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 65 页 / 657 K
品牌: ELPIDA [ ELPIDA MEMORY ]
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EDE5104AGSE, EDE5108AGSE  
Operation of DDR2 SDRAM  
Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and continue  
for the fixed burst length of four or eight in a programmed sequence. Accesses begin with the registration of an  
active command, which is then followed by a read or write command. The address bits registered coincident with  
the active command is used to select the bank and row to be accessed (BA0, BA1 select the bank; A0 to A13 select  
the row). The address bits registered coincident with the read or write command are used to select the starting  
column location for the burst access and to determine if the auto precharge command is to be issued.  
Prior to normal operation, the DDR2 SDRAM must be initialized. The following sections provide detailed information  
covering device initialization; register definition, command descriptions and device operation.  
Power On and Initialization  
DDR2 SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than  
those specified may result in undefined operation.  
Power-Up and Initialization Sequence  
The following sequence is required for power up and initialization.  
1. Apply power and attempt to maintain CKE below 0.2 × VDDQ and ODT *1 at a low state (all other inputs may be  
undefined.)  
VDD, VDDL and VDDQ are driven from a single power converter output, AND  
VTT is limited to 0.95V max, AND  
VREF tracks VDDQ/2.  
or  
Apply VDD before or at the same time as VDDL.  
Apply VDDL before or at the same time as VDDQ.  
Apply VDDQ before or at the same time as VTT and VREF.  
at least one of these two sets of conditions must be met.  
2. Start clock and maintain stable condition.  
3. For the minimum of 200µs after stable power and clock(CK, /CK), then apply [NOP] or [DESL] and take CKE  
high.  
4. Wait minimum of 400ns then issue precharge all command. [NOP] or [DESL] applied during 400ns period.  
5. Issue EMRS(2) command. (To issue EMRS(2) command, provide low to BA0, high to BA1.)  
6. Issue EMRS(3) command. (To issue EMRS(3) command, high to BA0 and BA1.)  
7. Issue EMRS to enable DLL. (To issue DLL enable command, provide low to A0, high to BA0 and low to BA1 and  
A13.)  
8. Issue a mode register set command for DLL reset.  
(To issue DLL reset command, provide high to A8 and low to BA0, BA1, and A13.)  
9. Issue precharge all command.  
10.Issue 2 or more auto-refresh commands.  
11.Issue a mode register set command with low to A8 to initialize device operation. (i.e. to program operating  
parameters without resetting the DLL.)  
12.At least 200 clocks after step 8, execute OCD calibration (Off Chip Driver impedance adjustment). If OCD  
calibration is not used, EMRS OCD default command (A9 = A8 = A7 = 1) followed by EMRS OCD calibration  
mode exit command (A9 = A8 = A7 = 0) must be issued with other operating parameters of EMRS.  
13.The DDR2 SDRAM is now ready for normal operation.  
Note: 1. To guarantee ODT off, VREF must be valid and a low level must be applied to the ODT pin.  
tCH tCL  
CK  
/CK  
tIS  
CKE  
Command  
Any  
command  
REF  
MRS  
EMRS  
EMRS  
PALL  
PALL  
EMRS  
MRS  
REF  
NOP  
tRP  
tRFC  
tRFC  
tMRD  
Follow OCD  
Flowchart  
tOIT  
tRP  
tMRD  
tMRD  
400ns  
DLL reset  
DLL enable  
OCD default  
OCD calibration mode  
exit  
200 cycles (min)  
Power up and Initialization Sequence  
Preliminary Data Sheet E0715E20 (Ver. 2.0)  
26  
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