EBE41AE4ACFA
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
31
Module rank density
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
0
0
0
0
0
0
1
0
1
1
1
0
0
0
1
0
1
02H
17H
20H
25H
2GB
Address and command setup time
before clock (tIS)
-8E
32
0.17ns*1
0.20ns*1
0.25ns*1
-6E
Address and command hold time after
clock (tIH)
-8E
33
-6E
0
0
0
0
0
0
0
0
1
0
0
0
0
0
1
1
0
0
0
0
1
1
0
0
1
0
0
1
1
1
0
0
27H
05H
10H
12H
0.27ns*1
0.05ns*1
0.10ns*1
0.12ns*1
Data input setup time before clock (tDS)
-8E
34
35
-6E
Data input hold time after clock (tDH)
-8E
-6E
0
0
0
0
0
1
1
1
0
1
1
1
1
0
1
0
17H
3CH
0.17ns*1
15ns*1
36
37
Write recovery time (tWR)
Internal write to read command delay
(tWTR)
0
0
0
1
1
1
1
0
1EH
7.5ns*1
Internal read to precharge command
delay (tRTP)
38
39
40
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
1
1
1
0
0
0
0
1
0
1
0
1
1
1
0
1
1
1
1
0
0
0
1
1
1
0
0
1
1
1
0
1
1
0
1
1
0
1
0
1
1
0
1
1
0
0
1
0
0
0
1
0
0
0
0
1
0
1
0
0
0
0
1EH
00H
36H
06H
39H
3CH
7FH
80H
14H
18H
1EH
7.5ns*1
TBD
Memory analysis probe characteristics
Extension of Byte 41 and 42
-8E
-6E
Active command period (tRC)
-8E
41
57.5ns*1
60ns*1
-6E
Auto refresh to active/
Auto refresh command cycle (tRFC)
42
43
44
127.5ns*1
8ns*1
SDRAM tCK cycle max. (tCK max.)
Dout to DQS skew
-8E
0.20ns*1
0.24ns*1
0.30ns*1
-6E
Data hold skew (tQHS)
-8E
45
-6E
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
1
0
0
0
1
0
0
1
1
0
1
0
1
0
0
22H
0FH
00H
12H
0.34ns*1
46
PLL relock time
15µs
47 to 61
62
SPD Revision
Rev. 1.2
Checksum for bytes 0 to 62
-8E
63
0
0
0
1
0
1
1
1
17H
-6E
0
0
1
0
×
0
0
0
0
1
1
0
×
1
1
1
1
1
1
0
×
0
0
0
1
1
1
0
×
0
0
0
0
1
1
0
×
0
0
0
0
1
1
0
×
1
0
1
0
1
1
0
×
0
1
0
1
1
0
0
×
1
0
1
31H
7FH
FEH
00H
××
64 to 65 Manufacturer’s JEDEC ID code
66 Manufacturer’s JEDEC ID code
67 to 71 Manufacturer’s JEDEC ID code
Continuation code
Elpida Memory
72
73
74
75
Manufacturing location
Module part number
Module part number
Module part number
(ASCII-8bit code)
45H
42H
45H
E
B
E
Data Sheet E1078E40 (Ver. 4.0)
6
ELPIDA [ ELPIDA MEMORY ]
