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EBE11UD8AGSA-6E-E 参数 Datasheet PDF下载

EBE11UD8AGSA-6E-E图片预览
型号: EBE11UD8AGSA-6E-E
PDF下载: 下载PDF文件 查看货源
内容描述: 1GB DDR2 SDRAM SO- DIMM ( 128M字× 64位, 2级) [1GB DDR2 SDRAM SO-DIMM (128M words x 64 bits, 2 Ranks)]
分类和应用: 存储内存集成电路动态存储器双倍数据速率时钟
文件页数/大小: 22 页 / 207 K
品牌: ELPIDA [ ELPIDA MEMORY ]
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EBE11UD8AGSA  
Parameter  
Symbol Grade  
max.  
Unit  
mA  
Test condition  
tCK = tCK (IDD);  
Auto-refresh current  
(Another rank is in IDD2P)  
-6E  
IDD5  
2240  
2080  
Refresh command at every tRFC (IDD) interval;  
CKE is H, /CS is H between valid commands;  
Other control and address bus inputs are SWITCHING;  
Data bus inputs are SWITCHING  
-5C  
Auto-refresh current  
(Another rank is in IDD3N)  
-6E  
IDD5  
2720  
2520  
mA  
mA  
-5C  
Self Refresh Mode;  
CK and /CK at 0V;  
CKE 0.2V;  
Other control and address bus inputs are FLOATING;  
Data bus inputs are FLOATING  
Self-refresh current  
IDD6  
IDD7  
96  
all bank interleaving reads, IOUT = 0mA;  
BL = 4, CL = CL(IDD), AL = tRCD (IDD) 1 × tCK (IDD);  
tCK = tCK (IDD), tRC = tRC (IDD), tRRD = tRRD(IDD),  
tRCD = 1 × tCK (IDD);  
CKE is H, CS is H between valid commands;  
Address bus inputs are STABLE during DESELECTs;  
Data pattern is same as IDD4W;  
Operating current  
2640  
mA  
mA  
(Bank interleaving)  
(Another rank is in IDD2P)  
Operating current  
-6E  
IDD7  
3120  
3080  
(Bank interleaving)  
(Another rank is in IDD3N)  
-5C  
Notes: 1. IDD specifications are tested after the device is properly initialized.  
2. Input slew rate is specified by AC Input Test Condition.  
3. IDD parameters are specified with ODT disabled.  
4. Data bus consists of DQ, DM, DQS, /DQS, RDQS, /RDQS, LDQS, /LDQS, UDQS, and /UDQS. IDD  
values must be met with all combinations of EMRS bits 10 and 11.  
5. Definitions for IDD  
L is defined as VIN VIL (AC) (max.)  
H is defined as VIN VIH (AC) (min.)  
STABLE is defined as inputs stable at an H or L level  
FLOATING is defined as inputs at VREF = VDDQ/2  
SWITCHING is defined as:  
inputs changing between H and L every other clock cycle (once per two clocks) for address and control  
signals, and inputs changing between H and L every other data transfer (once per clock) for DQ signals  
not including masks or strobes.  
6. Refer to AC Timing for IDD Test Conditions.  
AC Timing for IDD Test Conditions  
For purposes of IDD testing, the following parameters are to be utilized.  
DDR2-667  
DDR2-533  
4-4-4  
4
Parameter  
CL(IDD)  
5-5-5  
5
Unit  
tCK  
ns  
tRCD(IDD)  
tRC(IDD)  
15  
15  
60  
60  
ns  
tRRD(IDD)  
tCK(IDD)  
7.5  
3
7.5  
ns  
3.75  
45  
ns  
tRAS(min.)(IDD)  
tRAS(max.)(IDD)  
tRP(IDD)  
45  
ns  
70000  
15  
70000  
15  
ns  
ns  
tRFC(IDD)  
105  
105  
ns  
Data Sheet E0827E10 (Ver. 1.0)  
11  
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