MP02 XX 130 Series
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP02 HB 130 - 22
MP = Pressure contact module
02
= Outline type
HB = Circuit configuration code (see "circuit options" - front page)
130 = Nominal average current rating at Tcase = 75oC
22
Examples:
MP02HB130 - 20
= VRRM/100
MP02G130 - 25
MP02GN130 - 18
Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when
requested.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of VTO and rT
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
An even coating of thermal compound (eg. Unial) should be
appliedtoboth theheatsinkandmodulemountingsurfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 6Nm (55lb.ins) is reached at both ends.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemicaletchantandthencleanedwithasolventtoremove
oxide build up and foreign material. Care should be taken
to ensure no foreign particles remain.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the other. Such action may DAMAGE the
module.
3/9
DYNEX [ Dynex Semiconductor ]
