PICK AND PLACE LOCATION
SURFACE-MOUNT TAPE & REEL
LEADED (Sn/Pb) PROCESS RECOMMEND TEMPERATURE PROFILE
Peak temp.
2nd Ramp-up temp.
210~230°C 5sec.
1.0~3.0°C /sec.
250
Pre-heat temp.
140~180°C 60~120 sec.
200
Cooling down rate <3°C /sec.
Ramp-up temp.
0.5~3.0°C /sec.
150
100
50
Over 200°C
40~50sec.
0
60
120
Time ( sec. )
180
240
300
Note: All temperature refers to assembly application board, measured on the land of assembly application board.
LEAD FREE (SAC) PROCESS RECOMMEND TEMPERATURE PROFILE
.
Temp
Peak Temp. 240 ~ 245
℃
220℃
200℃
Ramp down
max. 4 /sec.
℃
Preheat time
90~120 sec.
150℃
25℃
Time Limited 75 sec.
above 220
℃
Ramp up
max. 3 /sec.
℃
Time
Note: All temperature refers to assembly application board, measured on the land of assembly application board.
DS_DNL10SMD_07182012
14
DELTA [ DELTA ELECTRONICS, INC. ]
