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XB24CZ7RIS-004 参数 Datasheet PDF下载

XB24CZ7RIS-004图片预览
型号: XB24CZ7RIS-004
PDF下载: 下载PDF文件 查看货源
内容描述: XBee® /的XBee - PRO® ZB SMT射频模块 [XBee®/XBee-PRO® ZB SMT RF Modules]
分类和应用: 射频
文件页数/大小: 155 页 / 3791 K
品牌: DCD [ DIGITAL CORE DESIGN ]
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XBee®/XBeePRO® ZB SMT RF Modules  
XBee Programmable Bootloader  
Overview  
The XBee Programmable module is equipped with a Freescale MC9S08QE32 application processor. This  
application processor comes with a supplied bootloader. This section describes how to interface the  
customer's application code running on this processor to the XBee Programmable module's supplied  
bootloader.  
The first section discusses how to initiate firmware updates using the supplied bootloader for wired and over-  
the-air updates.  
Bootloader Software Specifics  
Memory Layout  
The figure below shows the memory map for the MC9S08QE32 application processor.  
The supplied bootloader occupies the bottom pages of the flash from 0xF200 to 0xFFFF. Application  
code cannot write to this space.  
The application code can exist in Flash from address 0x8400 to 0xF1BC. 1k of Flash from 0x8000 to  
0x83FF is reserved for Non Volatile Application Data that will not be erased by the bootloader during a  
flash update.  
A portion of RAM is accessible by both the application and the bootloader. Specifically, there is a  
shared data region used by both the application and the bootloader that is located at RAM address  
0x200 to 0x215. Application code should not write anything to AppResetCause or BLResetCause unless  
informing the bootloader of the impending reset reason.  
© 2010 Digi International, Inc.  
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