LEAD FREE REFLOW SOLDERING CONDITION
(Applicable to Chip Type Aluminum Electrolytic Capacitors)
Recommended Conditions for Reflow Soldering
(1) A thermal condition system such as infrared radiation (IR) or hot blast should be adopted, and
vapor heat transfer systems (VPS) are not recommended.
(2) Reflow soldering should be performed one time. If the capacitor has to be reflowed twice, 30
minutes must be layout between each time.
(3) For lead-free type reflow soldering, please observe proper conditions below:
a) The time of preheating from 150°C to 200°C shall be within maximum 180 seconds;
b) The time of soldering temperature at 217°C measured on capacitors' top shall not exceed
tL (second);
c) The peak temperature on capacitors' top shall not exceed Tp(°C), and the time within 5°C
of actual peak temperature shall not exceed tp (second).
Classification Reflow Profile
tp
Critical Zone
217 to Tp
T p
*1
Ramp-up
21 7
20 0
t
L
* 2
Ramp-down
15 0
2 5
P re h e a t 1 8 0 s ec Ma x
¤
2 5
to Pe a k * 3
*1. Average ramp-up rate is 3ć/second max.
*2. Ramp-down rate is 6ć/second max.
T im e
*3. Time from 25ć to peak temperature is 8 minutes max.
Allowable Range of Peak Temperature
Size
Thickness (mm)
Volume (mm3)
<350
Tp(°C)
tL (second)
tp (second)
250 0
240 0
235 0
230 0
90
90
5
5
5
5
4~6.3, 8u6.2L
8u10.5L
t2.5
t2.5
t2.5
t2.5
350~2000
350~2000
>2000
60
10u10.5L/13.5L
12.5, 16
30 (20*)
Re: (20*) is special for mid-to-high voltage which is HU series.ꢀ
ꢀ
Recommended Land Size (Unit: mm)
Size
4
a
b
c
1.6
1.6
1.6
2.1
3.0
4.0
4.0
6.0
2.6
3.0
3.5
4.5
3.5
4.0
5.7
6.5
1.6
1.6
1.6
1.6
2.5
2.5
3.0
3.5
5
6.3
8×6.2L
8×10.5L
10
12.5
16×16.5/21.5
DB LECTRO Inc. 3755 Place Java, Suite 140, Brossard, Québec, J4Y 0E4, Canada - T: 1-450-444-1424 / F: 1-450-444-4714 / www.dblectro.com
DBLECTRO [ DB LECTRO INC ]
