DM562P
V.90 Integrated Data/ Fax/Voice/Speakerphone
Modem Device Single Chip with Memory Built in
LQFP 48L (F.P. 2mm) Outline Dimensions
unit: inches/mm
y
Θ
0-12°
0-12°
Symbol
Dimensions in inches
Dimensions in mm
Min.
Nom.
-
Max.
Min.
Nom.
-
Max.
Notes:
A
A1
A2
b
-
0.063
0.006
0.057
0.011
0.009
0.008
0.006
-
1.60
0.15
1.45
0.27
0.23
0.20
0.16
1.To be determined at seating plane.
0.002
0.053
0.007
0.007
0.004
0.004
-
0.05
1.35
0.17
0.17
0.09
0.09
-
2.Dimensions D1 and E 1do not include mold
protrusion. D1 and E1 are maximum plastic
body size dimensions including mold
mismatch.
3.Dimensions b does not include dambar
protrusion. Total in excess of the b dimension
at maximum material condition. Dambar
cannot be located on the lower radius of the
foot.
4.Exact shape of each corner is optional.
5.These dimensions apply to the flat section of
the lead between 0.10mm and 0.25mm from
the lead tip.
6.A1 is defined as the distance from the seating
plane to the lowest point of the package body.
7.Controlling dimension: millimeter.
8.Reference documents: JEDEC MS-026, BBC.
0.055
1.40
0.009
0.22
b1
C
0.008
0.20
-
-
C1
D
-
-
0.354BSC
0.276BSC
0.354BSC
0.276BSC
0.020BSC
0.024
9.00BSC
7.00BSC
9.00BSC
7.00BSC
0.50BSC
0.60
D1
E
E1
e
L
L1
y
0.018
0.030
0.45
0.75
0.039REF
0.003MAX
1.00REF
0.08MAX
Final
47
Version: DM562P-DS-F01
February 02, 2004
DAVICOM [ DAVICOM SEMICONDUCTOR, INC. ]
