Spec. No. : C705Q8
Issued Date : 2007.08.22
Revised Date :
CYStech Electronics Corp.
Page No. : 12/12
SOP-8 Dimension
Right side View
Marking:
G
Top View
A
Memory:
1K: 01
I
2K: 02
4K: 04
8K:08
24BC □□
□□□□
C
B
H
J
Date Code
16K:16
D
Front View
Part A
E
K
Part A
L
N
8-Lead SO-8 Plastic Package
CYStek Package Code: Q8
M
O
F
*: Typical
Millimeters
Inches
DIM
Millimeters
Inches
DIM
Min.
Max.
0.2007
Min.
Max.
5.10
3.95
6.20
1.32
0.47
3.88
1.65
5.10
Min.
Max.
Min.
Max.
0.20
0.70
0.25
0.52
0.50
0.13
0.15
A
B
C
D
E
F
0.1909
0.1515
0.2283
0.0480
0.0145
0.1472
0.0570
0.1889
4.85
3.85
5.80
1.22
0.37
3.74
1.45
4.80
I
J
0.0019
0.0118
0.0074
0.0145
0.0118
0.0031
0.0000
0.0078
0.0275
0.0098
0.0204
0.0197
0.0051
0.0059
0.05
0.30
0.19
0.37
0.30
0.08
0.00
0.1555
0.2441
0.0519
0.0185
0.1527
0.0649
0.2007
K
L
M
N
O
G
H
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CTK24BC01-16Q8
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
