CYStech Electronics Corp.
SMA-1 Dimension
Spec. No. : C338AS
Issued Date : 2004.03.10
Revised Date :
Page No. : 3/3
Marking :
Device CSMA CSMA CSMA CSMA
SS12 SS13 SS14 SS15
Code SS12 SS13 SS14 SS15
Device CSMA CSMA CSMA
SS16 SS18 SS1B
Code SS16 SS18 SS1B
A
B
C
D
H
E
F
G
2-Lead SMA-1 Plastic
Surface Mounted Package
CYStek Package Code: AS
*:Typical
DIM
A
B
C
D
Inches
Min.
Max.
0.055
0.062
0.098
0.114
0.157
0.181
0.078
0.096
Millimeters
Min.
Max.
1.40
1.60
2.50
2.90
4.00
4.60
2.00
2.44
DIM
E
F
G
H
Inches
Min.
Max.
0.030
0.060
0.002
0.008
0.188
0.208
0.006
0.012
Millimeters
Min.
Max.
0.76
1.52
0.051
0.203
4.80
5.28
0.152
0.305
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CSMASS1XAS
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
