CY8C29x66 Final Data Sheet
4. Packaging Information
4.3
Capacitance on Crystal Pins
Package
Package Capacitance
Table 4-2: Typical Package Capacitance on Crystal Pins
28 PDIP
28 SSOP
28 SOIC
44 TQFP
48 SSOP
48 QFN
100 TQFP
3.5 pF
2.8 pF
2.7 pF
2.6 pF
3.3 pF
1.8 pF
3.1 pF
4.4
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 4-3. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature*
Maximum Peak Temperature
28 PDIP
28 SSOP
28 SOIC
44 TQFP
48 SSOP
48 QFN
100 TQFP
220
o
C
240
o
C
220
o
C
220
o
C
220
o
C
220
o
C
220
o
C
260
o
C
260
o
C
260
o
C
260
o
C
260
o
C
260
o
C
260
o
C
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
o
C
with Sn-Pb or 245 ± 5
o
C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
August 5, 2008
Document No. 38-12013 Rev. *J
43
CYPRESS [ CYPRESS SEMICONDUCTOR ]
