CY8C27x43 Final Data Sheet
4. Packaging Information
4.2
Thermal Impedances
Table 4-1. Thermal Impedances per Package
Package
8 PDIP
Typical θJA
*
120 oC/W
95 oC/W
79 oC/W
67 oC/W
95 oC/W
71 oC/W
58 oC/W
69 oC/W
18 oC/W
20 SSOP
20 SOIC
28 PDIP
28 SSOP
28 SOIC
44 TQFP
48 SSOP
48 MLF
* TJ = TA + POWER x θJA
4.3
Capacitance on Crystal Pins
Table 4-2: Typical Package Capacitance on Crystal Pins
Package
8 PDIP
Package Capacitance
2.8 pF
20 SSOP
20 SOIC
28 PDIP
28 SSOP
28 SOIC
44 TQFP
48 SSOP
48 MLF
2.6 pF
2.5 pF
3.5 pF
2.8 pF
2.7 pF
2.6 pF
3.3 pF
2.3 pF
August 3, 2004
Document No. 38-12012 Rev. *I
41
CYPRESS [ CYPRESS ]
