CY8C24094, CY8C24794, CY8C24894, and CY8C24994 Final Data Sheet
4. Packaging Information
Figure 4-2. 68-Lead (8x8 mm x 0.89 mm) QFN
51-85214 *C
Important Note For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
Important Note Pinned vias for thermal conduction are not required for the low-power PSoC device.
February 15, 2007
Document No. 38-12018 Rev. *J
40
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