CY62256
Thermal Resistance
Description
Test Conditions
Symbol
DIP
SOIC TSOP RTSOP
Unit
Thermal Resistance
Still Air, soldered on a 4.25 x 1.125
ΘJA
75.61 76.56 93.89
93.89
°C/W
(Junction to Ambient)[5]
inch, 4-layer printed circuit board
Thermal Resistance
ΘJC
43.12 36.07 24.64
24.64
°C/W
(Junction to Case)[5]
AC Test Loads and Waveforms
R1 1800 Ω
R1 1800Ω
5V
OUTPUT
5V
OUTPUT
ALL INPUT PULSES
90%
3.0V
GND
90%
10%
10%
R2
R2
100 pF
5 pF
990Ω
990Ω
< 5 ns
< 5 ns
INCLUDING
JIG AND
SCOPE
INCLUDING
JIG AND
SCOPE
(a)
(b)
Equivalent to:
THÉVENIN EQUIVALENT
639Ω
OUTPUT
1.77V
Data Retention Characteristics
Parameter
VDR
ICCDR
Description
VCC for Data Retention
Data Retention Current
Conditions[6]
Min.
2.0
Typ.[2]
Max.
50
5
10
10
Unit
V
L
LL
LL - Ind’l
LL - Auto
VCC = 3.0V, CE > VCC − 0.3V,
IN > VCC − 0.3V, or VIN < 0.3V
2
µA
µA
µA
µA
ns
V
0.1
0.1
0.1
[5]
tCD[5R]
tR
Chip Deselect to Data Retention Time
Operation Recovery Time
0
tRC
ns
Data Retention Waveform
DATA RETENTION MODE
> 2V
3.0V
3.0V
V
V
CC
DR
t
t
R
CDR
CE
Notes:
6. No input may exceed V + 0.5V.
CC
Document #: 38-05248 Rev. *C
Page 4 of 12
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