CG6233AS
Package Drawing and Dimensions
8-lead (150-Mil) SOIC S8
8 Lead (150 Mil) SOIC - S08
PIN 1 ID
4
1
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
3. REFERENCE JEDEC MS-012
0.230[5.842]
0.244[6.197]
0.150[3.810]
0.157[3.987]
4. PACKAGE WEIGHT 0.07gms
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
5
8
0.189[4.800]
0.196[4.978]
SEATING PLANE
0.010[0.254]
0.016[0.406]
X 45°
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.050[1.270]
BSC
0.004[0.102]
0.0098[0.249]
0°~8°
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
51-85066-*C
All product or company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-07625 Rev. *A
Page 5 of 6
© Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
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