BCM89359 Advance Data Sheet
Table of Contents
SDIO Default Mode Timing ................................................................................................................. 130
SDIO High-Speed Mode Timing.......................................................................................................... 132
SDIO Bus Timing Specifications in SDR Modes ................................................................................. 133
Clock Timing ................................................................................................................................ 133
Device Input Timing ..................................................................................................................... 134
Device Output Timing................................................................................................................... 135
SDIO Bus Timing Specifications in DDR50 Mode............................................................................... 137
Data Timing, DDR50 Mode.......................................................................................................... 138
PCI Express Interface Parameters.......................................................................................................... 139
JTAG Timing ............................................................................................................................................. 141
Section 19: Power-Up Sequence and Timing ............................................................... 142
Sequencing of Reset and Regulator Control Signals ........................................................................... 142
Description of Control Signals............................................................................................................. 142
Control Signal Timing Diagrams.......................................................................................................... 143
Section 20: Package Information................................................................................... 147
Package Thermal Characteristics........................................................................................................... 147
Junction Temperature Estimation and PSIJT Versus ThetaJC.............................................................. 147
Environmental Characteristics................................................................................................................ 148
Section 21: Mechanical Information .............................................................................. 149
Section 22: Ordering Information .................................................................................. 151
Appendix A: Pin List ....................................................................................................... 152
Broadcom®
September 9, 2014 • 89359-DS100-R
Page 8
BROADCOM CONFIDENTIAL
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