BCM4354 Data Sheet
Package Information
Section 22: Package Information
Package Thermal Characteristics
The information in Table 62 and Table 63 is based on the following conditions:
•
•
No heat sink, TA = 70°C. This is an estimate, based on a 4-layer PCB that conforms to EIA/JESD51–7
(101.6 mm × 101.6 mm × 1.6 mm) and P = 1.53W continuous dissipation.
Absolute junction temperature limits are maintained through active thermal monitoring and driver-based
techniques that may include duty-cycle limiting or turning off one of the TX chains, or both.
Table 62: WLCSP Package Thermal Characteristics
Characteristic
WLCSP
26.86
2.23
θ
θ
θ
JA (°C/W) (value in still air)
JB (°C/W)
JC (°C/W)
1.09
JT (°C/W)
JB (°C/W)
2.48
11.61
125
Maximum Junction Temperature Tj (°C)
Maximum Power Dissipation (W)
1.53
Table 63: WLBGA Package Thermal Characteristics
Characteristic
WLBGA
26.80
1.66
θ
θ
JA (°C/W) (value in still air)
JB (°C/W)
θJC (°C/W)
1.16
JT (°C/W)
JB (°C/W)
1.85
7.93
Maximum Junction Temperature Tj (°C)
Maximum Power Dissipation (W)
125
1.53
Broadcom®
October 15, 2014 • 4354-DS109-R
Page 184
BROADCOM CONFIDENTIAL
CYPRESS [ CYPRESS ]
