DATA SHEET
Am29F002B/Am29F002NB
2 Megabit (256 K x 8-Bit)
CMOS 5.0 Volt-only Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
■ Single power supply operation
■ Embedded Algorithms
— 5.0 Volt-only operation for read, erase, and
program operations
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Minimizes system level requirements
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
■ Manufactured on 0.32 µm process technology
— Compatible with 0.5 µm Am29F002 device
■ Minimum 1,000,000 write cycle guarantee per
■ High performance
sector
— Access times as fast as 55 ns
■ 20-year data retention at 125°C
— Reliable operation for the life of the system
■ Package option
■ Low power consumption (typical values at
5 MHz)
— 1 µA standby mode current
— 20 mA read current
— 32-pin TSOP
— 32-pin PLCC
— 30 mA program/erase current
■ Compatibility with JEDEC standards
■ Flexible sector architecture
— Pinout and software compatible with
single-power supply Flash
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
three 64 Kbyte sectors
— Superior inadvertent write protection
— Supports full chip erase
■ Data# Polling and toggle bits
— Sector Protection features:
— Provides a software method of detecting
program or erase operation completion
A hardware method of locking a sector to
prevent any program or erase operations within
that sector
■ Erase Suspend/Erase Resume
Sectors can be locked via programming equipment
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
■ Hardware reset pin (RESET#)
■ Top or bottom boot block configurations available
— Hardware method to reset the device to reading
array data (not available on Am29F002NB)
Publication# 21527 Rev: D Amendment: 8
Issue Date: November 17, 2009
This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.